| Customization: | Available |
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| Certification: | CE |
| Application: | 3D Sensors |
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Features
• 7060 package
• Good thermal conduction
• Low threshold current
• Oxide isolation technology
• High reliability and Easy to collimate
Applications
• 3D sensor
• IR illumination
• Medical application
• Lidar
• Machine vision
| Parameter | Typ. |
| Center Wavelength | 850±10nm |
| Output Power | 500mW |
| Threshold Current | 0.4A |
| Forward Current | 2.7A |
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Power Conversion Efficiency |
36% |
| Slope Efficiency | 0.96W/A |
| Die Size | 960×950um |
| Laser Forward Voltage | 2.25V |
| Series Resistance | 0.83Ω |
| Beam Angle | 20Degrees |
| Wavelength Temp. Drift | 0.07nm/ºC |
| Soldering Temperature | 260(5s)ºC |
| Substrate | Cu/Ag |
| Case Operating Temp | 20ºC |
| Storage Temp | 20ºC |
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