Certification: | CE |
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Application: | 3D Sensors |
Structure: | Diode |
Output Power: | 500MW |
Wavelength: | 850nm |
Warranty: | One Year |
Samples: |
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Customization: |
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Features
• 7060 package
• Good thermal conduction
• Low threshold current
• Oxide isolation technology
• High reliability and Easy to collimate
Applications
• 3D sensor
• IR illumination
• Medical application
• Lidar
• Machine vision
Parameter | Typ. |
Center Wavelength | 850±10nm |
Output Power | 500mW |
Threshold Current | 0.4A |
Forward Current | 2.7A |
Power Conversion Efficiency |
36% |
Slope Efficiency | 0.96W/A |
Die Size | 960×950um |
Laser Forward Voltage | 2.25V |
Series Resistance | 0.83Ω |
Beam Angle | 20Degrees |
Wavelength Temp. Drift | 0.07nm/ºC |
Soldering Temperature | 260(5s)ºC |
Substrate | Cu/Ag |
Case Operating Temp | 20ºC |
Storage Temp | 20ºC |
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