Customization: | Available |
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Certification: | CE |
Application: | 3D Sensors |
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Key Features
850nm single wavelength
Low wavelength drift
Oxide isolation technology
Low threshold current
Small emission area
Easy to collimate
Applications
3D sensors
Lidars
IR illuminations
Medical applications
Proximity sensors
Industrial application
5mw 850nm Vertical Cavity Surface Emitting Laser Die Unmounted Chip Packaging Suggestion
For packaging, the user should use high thermal conductive substrate with AlN or copper; the user also attaches die onto the substrate using high thermal conductive materials such as nanosilver gel or AuSn. The user should have the equipments such as die attachment, wire bonder etc., which should be located in 1000 class clean room. For further assistance in need, please feel free to contact us! We would work with you to solve your issues.
Electrical Optical Characteristics | Typ. |
Threshold Current | 1.3mA |
Forward Voltage | 2.0V |
Differential Resistance | 75Ohms |
Slope Efficiency | 1W/A |
Output Power | 6mW |
Power Conversion Efficiency | 41% |
Wavelength | 850nm |
Divergence Angle | 20Deg |
Size | |
Die Size | 170umx170um |
Die Thickness | 130um |
Number of Emitters | 1 |
Bond Pad Size(Anode Pad) | 90um |
Back Electrode Size(Cathode Pad) | 170umx170um |