| Customization: | Available |
|---|---|
| Certification: | CE |
| Application: | Medical |
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The package of 3W 1470nm COS Laser Diode LD is chip on submount. The Chip on Submount package is ideal for incorporation into OEM solutions. Brandnew' chip on submount package has two large gold wire bond pads that provide contact to the cathode and anode of the semiconductor laser diode. The chip is manufactured to form a FP laser cavity tuned to emit radiation at the desired wavelength.
Features:
Chips on Submount
AuSn bonding RoHS compliance
High Reliability and Stability
High temperature resistance
Efficiency packaging heat dissipation technology
Applications:
Efficient pumping of DPSSL and fiber lasers
Material processing
Medical
Illumination
| Optical | Typ. |
| Center Wavelength | 1470nm |
| Wavelength Tolerance | 10nm |
| Output Power | 3.5W |
| Emitter Width | 95um |
| Spectrum Width FWHM | 10nm |
| Fast Axis Divergence FWHM | 30Deg |
| Slow Axis Divergence FWHM | 10Deg |
| Electrical | |
| Threshold Current Ith | 0.8A |
| Operating Current Iop | 9A |
| Operating Voltage Vop | 1.3V |
| Slope Efficiency | 0.45W/A |
| Conversion Efficiency | 30% |
| Polarization | TE |
|
Thermal |
|
| Test Temperature | 25ºC |
| Storage Temperature | -30-70ºC |
| Wavelength Temperature Coefficient | 0.35nm/ºC |
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